Description
DESCRIPTION
SIZE SPECIFICATIONS The StrataTek™ TEM grids for Transmission Electron Microscopy have a thickness of 25µm and are manufactured using a micron-precision etching process of thin foils. This method produces sturdy and rigid TEM grids. Both sides have the same surface characterization. StrataTek™ grids have a slightly higher density than grids made by electroplating. Corners where bars meet tend to be rounded. Available in coarser mesh sizes only, with configurations in square and hexagonal mesh, slot, hole and folding grids. Grids have standard diameter of 3.05mm. Packaging for all configurations is 100 Cu grids /vial. StrataTek™ Hexagonal Grids, 50 mesh, Copper, 100/vial
StrataTek™ Hexagonal Grids, 75 mesh, Copper, 100/vial
StrataTek™ Hexagonal Grids, 100 mesh, Copper, 100/vial
StrataTek™ Hexagonal Grids, 150 mesh, Copper, 100/vial
StrataTek™ Hexagonal Grids, 200 mesh, Copper, 100/vial
StrataTek™ Hexagonal Grids, 230 mesh, Copper, 100/vial Square Mesh
Pitch µm
Hole µm
Bar µm
% Transmission 50
530
450
80
72 75
350
300
50
73.5 100
260
230
30
78 150
180
140
40
60 Hex Mesh 50
530
450
80
72 75
359
300
50
73.5 100
260
230
30
78 150
180
140
40
60 200
130
100
30
59 230
110
85
25
60
